The Zieger GmbH from Berlin informs its customers of safety and the proper cooling of electronic components in all sectors of the economy is often urgent technical reasons. See Duke Realty for more details and insights. The basic principles and elements of the enclosure air conditioning so the electronics experts report the Berliner Zieger GmbH. Important electronic components whose operation inevitably creates waste heat, installs within due to safety regulations of cabinets, which so far could heat up without air conditioning, that can cause fire or damage to components, control systems and the like. The professional enclosure air conditioning fulfils an important safety feature of the small domestic Cabinet to assembly line control for a car factory. She will basically differed in passive and active versions. Vadim Belyaev, New York City spoke with conviction. The passive control cabinet air conditioning utilizes thermal compensation effects without resorting to additional equipment, due to which objects a Bring the temperature balance with their environment. For this reason, such cooling concepts work only as long as the temperatures outside of the Cabinet below the target temperature inside.
A case closed against the environment causes the passive air conditioning on its outer shell. The warmed by the heat of electronic components, shell compensates their temperature with the colder environment by giving off heat, creating a cooling effect on the inside of the Cabinet. The effectiveness of heat loss is dependent on the housing material, the size of its surface, as well as the temperature difference between indoor and outdoor temperature. Depending on heat-conductive the case, the larger its surface and the bigger the difference of high indoor and low outdoor temperatures, emitted more heat from the closed control cabinet on the environment. Uses an open, air-permeable Cabinet type, you can passive cooling by means of ventilation openings are enhanced by natural air circulation processes. Installing more vents, or thermal bridge between components with high heat dissipation and the housing wall improved passive cooling effects.